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US Patent Issued to Micron Technology on Oct. 27 for "Heat transfer system controller and method" (Idaho Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,615, issued on Oct. 27, was assigned to Micron Technology Inc. (Boise, Idaho). "Heat transfer system controller and method" was invented by... Read More


US Patent Issued to SUGON DATAENERGY (BEIJING) on Oct. 27 for "Self-adjusting fluid cooling system for electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,616, issued on Oct. 27, was assigned to SUGON DATAENERGY (BEIJING) Co. LTD. (Beijing). "Self-adjusting fluid cooling system for electronic ... Read More


US Patent Issued to Microsoft Technology Licensing on Oct. 27 for "Systems and methods for cryogenic cooling" (Washington Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,617, issued on Oct. 27, was assigned to Microsoft Technology Licensing LLC (Redmond, Wash.). "Systems and methods for cryogenic cooling" wa... Read More


US Patent Issued to City University of Hong Kong on Oct. 27 for "Radiative cooling interface for wearable electronic device" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,618, issued on Oct. 27, was assigned to City University of Hong Kong (Kowloon, Hong Kong). "Radiative cooling interface for wearable electr... Read More


US Patent Issued to Micron Technology on Oct. 27 for "Unified solid-state drive enclosure design" (Indian Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,619, issued on Oct. 27, was assigned to Micron Technology Inc. (Boise, Idaho). "Unified solid-state drive enclosure design" was invented by... Read More


US Patent Issued to Apple on Oct. 27 for "Electronic devices including an indicium with a thermal conduit" (California, Texas Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,620, issued on Oct. 27, was assigned to Apple Inc. (Cupertino, Calif.). "Electronic devices including an indicium with a thermal conduit" w... Read More


US Patent Issued to HONOR DEVICE on Oct. 27 for "Electronic device comprising recess in buffer component for removing heat generated by electronic components" (Chinese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,621, issued on Oct. 27, was assigned to HONOR DEVICE Co. LTD. (Shenzhen, China). "Electronic device comprising recess in buffer component f... Read More


US Patent Issued to Nvidia on Oct. 27 for "Primary cooling loop control to address fluctuation demands on secondary cooling loops for datacenter cooling systems" (California, Texas Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,622, issued on Oct. 27, was assigned to Nvidia Corp. (Santa Clara, Calif.). "Primary cooling loop control to address fluctuation demands on... Read More


US Patent Issued to TMEIC on Oct. 27 for "Electric power conversion apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,623, issued on Oct. 27, was assigned to TMEIC Corp. (Tokyo). "Electric power conversion apparatus" was invented by Kei Matsumoto (Tokyo). ... Read More


US Patent Issued to SEMES on Oct. 27 for "Power supply panel, power supply structure and facility for transporting substrate" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,624, issued on Oct. 27, was assigned to SEMES Co. LTD. (Chungcheongnam-do, South Korea). "Power supply panel, power supply structure and fa... Read More